Graphics Solutions
Established in 2006, the Munich-based Graphics Competence Center specializes in hard- and software product development. Through our technical customer support and marketing expertise, we have established ourselves as leaders in embedded graphics solutions.
We maintain close contact with European customers to monitor current and future requirements for embedded graphics applications, reflecting the industry trend towards greater functionality, performance and integration.
System-on-Chip and Graphics Processors expertise to meet your needs. Market analysis, product specification, hardware & software development, prototyping & evaluation board design are combined under one roof, enabling us to offer optimized solutions for a comprehensive range of automotive and embedded environments.
The engineering services we offer include software implementation, the development of drivers and tool suites, and customization of APIs and tools. We also offer HMI design and integration for proof-of-concepts. Close co-operation with our customers ensures each product is tailored to its exact application. In-house customer training and product-specific hardware & software support round off the GCC service portfolio.
Graphics Solutions
Based on the ARM® Cortex® which includes the A9 and A5, the System on Chip (SoC) family combines a broad level of integration on a single chip architecture. This scalable multicore platform includes single, dual and quad core based solutions. These coordinated powerful graphic processors offer highly flexible designs of user interfaces in 3D and/or 2D. This next level of multimedia processing provides advanced video technology in a variety of visual qualities. Targeting consumer, industrial, medical and automotive solutions, the family offers the right solution for customer needs and all parts are automotive qualified.
For applications in the field of remote displays and cameras, this product line-up also supports high speed APIX® interfaces from Inova Semiconductors. This point-to-point connectivity transmits uncompressed and resolution independent pixel data over long distances.
The ARM9™ processor SoC family enables ultra low cost single processor solutions. This device is highly optimized for various types of applications which require low power CPU performance in combination with sophisticated 2D/3D graphics features in a compact SoC. The product incorporates Inova Semiconductors’ innovative APIX® GBit/s interface (Automotive Pixel Link).
Related Products
| SoC Series | Package | CPU | 3D GPU | 2D GPU | Vision Processor | Video Capture | Display Controller | APIX® | Video En/Decoder | TS Demux |
|---|---|---|---|---|---|---|---|---|---|---|
| MB86R1x | TE BGA 544 |
ARM Cortex A9 533 MHz |
Socionext 'Arges' core OpenGL ES 2.0 |
Socionext SEERIS | No | 4x | 3x | 3x APIX 2.0 | No | No |
| MB86R2x | FC BGA 672 |
Dual ARM Cortex A9 533MHz |
PowerVR™ SGX543 OpenGL ES 2.0 |
Socionext SEERIS | No | 6x | 3x | No | No | No |
| SC1810 | FC BGA 672 |
Quad ARM Cortex A9 1 GHz |
PowerVR™ S8XE OpenGL ES 3.1 |
Socionext SEERIS MDP2 | Yes | 6x | 3x | No | Yes | No |
| MB8AL203x | PBGA 484 |
Quad ARM Cortex A5 400 MHz |
PowerVR™ SGX531 OpenGL ES 2.0 |
- | No | 2x | 2x | No | Yes | Yes |
Downloads
Socionext-Application-Catalogue
socionext-application-catalog.pdf
Size: 5.555 Megabyte | Date: 28.02.2018 21:22
Built on SOCIONEXT’s 2D SEERIS™ Pixel Engine, enables highly optimized and cost attractive solutions for a broad range of remote display uses up to 4k resolutions. Reduces the overall BOM and allows the realization of future proof architectures. Performs all graphics processing in a line-buffer based scheme, combined with a versatile and flexible sprite engine.
Integrates APIX video link up to 12 Gbps link speed. Includes safety features such as signature units to monitor the integrity of display contents, thus supporting the certification of Automotive Safety Integrity. Enables camera connectivity over Ethernet and supports touch controller connectivity through its back channel.
| Products | Resolution | Package | Input | Output | Video-link | SRAM Flash | Signature Units |
|---|---|---|---|---|---|---|---|
| MB88F334/-6 | 1920x1024 | LQFP-208, 28x28mm | - | TCON, OpenLDI |
3 Gbps APIX®2 Rx with HDCP |
64k / 32k | 4 |
| SC1711AH5 | 1280x480 | LQFP-176, 20x20mm | - | TCON, OpenLDI | 1 Gbps APIX®2 Rx | 128k /56k | 4 |
| MB86R91 | - | FBGA-289, 15x15mm | OpenLDI, LVDS | 2x MIPI-CSI2 |
1x 3 Gb/s APIX®2 Rx 3x 3 Gb/s APIX®2 Tx |
- | - |
| SC1701AK3-100 | 3840x2160 | BGA-319, 23x23mm | MIPI-DSI, LVDS | OLDI miniLVDS TCON |
2x 6 Gb/s APIX®3 Rx with HDCP |
256k / 128k | 2x8 |
| SC1701AH5-100 | 1920x1080 | EPLQFP-216, 24x24mm | MIPI-DSI LVDS | TCON, OpenLDI, mini-LVDS |
2x 3 Gb/s APIX®3 Rx with HDCP |
256k / 128k | 8 |
| SC1701AK3-200 | 3840x2160 | HSBGA-319, 23x23mm | MIPI-DSI LVDS | TCON, OpenLDI, mini-LVDS | - | 256k / 128k | 2x8 |
| SC1701AH5-200 | 1920x1080 | EPLQFP-216, 24x24mm | MIPI-DSI LVDS | TCON, OpenLDI, mini-LVDS | - | 256k / 128k | 8 |
Downloads
Socionext-Application-Catalogue
socionext-application-catalog.pdf
Size: 5.555 Megabyte | Date: 28.02.2018 21:22
Unified Engines for Graphics, Display and Capture
The SEERIS ® 2D Graphics IP is a building block concept combining a collection of graphics processing units with focus on 2D operations, display control and video capture which can be combined on a system level to a more complex graphic subsystem. Implemented as a high-quality, synthesizable Soft IP, it allows an easy adaption to existing semiconductor technologies.
With its generic, flexible and silicon-proven concept it is made for a wide range of System-on-Chips and is capable
of working with different types, sizes and resolutions. In total over 10 different variants for application processors, GPUs, MCUs, Codecs and GDCs are used for in-house and several external customer projects. Initially developed for automotive applications with additional features to support safety critical use cases, it is used and suitable for many other applications. Therefore the SEERIS ® 2D Graphics Engine IP is continuously updated with new technologies and features.
Applications
Automotive
- Instrument Clusters
- Multimedia and Infotainment
- Driver Assistance Systems
Consumer
- Smart Devices
- Digital Cameras
- Internet of Things
Embedded
- Connected Home
- Healthcare
- Home Electronics
SoC Design Architecture
Architecture
- All buffer formats 100% compatible
- Flexible pixel formats (1 to 32 bpp; any bit width per channel)
- YUV support (packed, planar, 4:4:4, 4:2:2, 4:2:0, progressive, interlaced)
- Dynamic re-configuration of processing units
- Ready to support standards (i.e. OpenWF)
- Command sequencer included
Display
- Scan directions: 90/180/270° rotation, horizontal/vertical flip
- Multiple layers (alpha blend) with configurable mapping
- Scaling and warping on-the-fly (e.g. windshield correction)
- Image compression and decompression on-the-fly
- Special safety features
- Dual display modes and programmable timing generators
Blit
- Fast single pass blit operations
- Scaling & rotation
- Perspective warping (simple 3D effects = “2.5D”)
- Arbitrary warping (e.g. for lens distortion removal or HuD)
- High quality re-sampling (super-sampling, anisotropic)
- Image compression and decompression
- Programmable FIR filter (blurring, sharpening, etc)
Capture
- All common input capture formats supported (e.g. ITU656)
- Down-scaling, de-interlacing, histogram measurement and color correction unit
- Support for fractional ring buffer size (optimized memory layout)
SEERIS® Graphics IP Flyer
Scalable Building Block Concept
SEERIS_Graphics_IP.pdf
Size: 1.364 Megabyte | Date: 08.02.2019 10:40