Socionext Europe • socionext-ew25

Socionext to Showcase Advanced SoC Technologies at Embedded World 2025

Driving Innovation Across Automotive, Data Center & Networking, Industrial and IoT Applications

We will present our latest innovations at Embedded World 2025 in Nuremberg, Germany, from March 11-13. At Booth 4A-628 visitors can explore cutting-edge advancements in automotive, networking, data center, industrial, and IoT applications – all designed to tackle the industry’s most complex challenges.

Press Release (440.91 KB) pdf

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[1] The "Solution SoC" business model enables Socionext to act as a trusted partner throughout a customer’s entire product development cycle, from initial design through production and delivery. Socionext offers comprehensive tailored SoCs to ensure quality and differentiation.

Next-Level SoC Offerings

Socionext will highlight its expertise in delivering high-performance, scalable, and energy-efficient SoCs that cater to industry-specific needs. Attendees can see select partner exhibits showcasing real-world applications that highlight Socionext’s Solution SoC [1] approach.

Automotive: Chiplet-based architectures for AI-powered ADAS, high-performance computing, and next-generation automotive semiconductor solutions.
Data Center & Networking: Scalable, power-efficient SoCs supporting advanced networking infrastructure and high-speed data processing.
Industrial & IoT: Custom semiconductor solutions optimized for automation, edge computing, and IoT connectivity.

See Select Partner Exhibits Showcasing Real-world Applications

Featured Presentation: The Future of Automotive Chiplet

As part of its presence at Embedded World 2025, Socionext’s Director Solution SoC / Data Center and Networking, Stewart Bell, will deliver an insightful talk on the strategic role of chiplets in automotive semiconductor innovation.

March 12, 2025 | 11:30 – 12:00
Exhibitor's Forum: Hall 3A-631

Connect with Socionext Experts at Booth 4A-628

Beyond the presentation, visitors can engage with Socionext experts to discuss tailored multi-silicon solutions that deliver optimized performance and cost-effectiveness across automotive, data center, networking, industrial, and IoT applications.